An Introduction to Electronics Systems Packaging

The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging.


The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level.

The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered.

Overview of electronic systems packaging

Introduction and Objectives of the course

Definition of a system and history of semiconductors

Products and levels of packaging

Packaging aspects of handheld products; Case studies in applications

Case Study (continued); Definition of PWB, summary and Questions for review

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