An Introduction to Electronics Systems Packaging
The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging.
The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level.
The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered.
Overview of electronic systems packaging
Introduction and Objectives of the course
Definition of a system and history of semiconductors
Products and levels of packaging
Packaging aspects of handheld products; Case studies in applications
Case Study (continued); Definition of PWB, summary and Questions for review